Scholarship & Fees

Asian Future Leaders Scholarship Program

The Hong Kong University of Science and Technology (HKUST) is participating in the Asian Future Leaders Scholarship Program (AFLSP) as one of its Anchor Universities. Under the administration of Bai Xian Asia Institute (BXAI), the AFLSP provides scholarships for high-caliber students to study abroad within Asia and a platform for students and educational institutions to cultivate lasting relationships based on mutual trust and understanding — essential tools for building bridges across cultures.

 

Scholarship Package

Here at HKUST, the AFLSP supports annually up to 10 scholarship places, which are for Asian students to pursue full-time research or taught postgraduate programs. Scholarships will be provided throughout the normative study period to cover tuition, lodging and daily subsistence costs.

Master of Philosophy (MPhil)

Scholarship of HK$216,000 (US$27,781) per year*, up to 2 years

 

Master of Science (MSc)/ Master of Arts (MA)/ Master of Public Policy (MPP) 

Full tuition and HK$97,188 (US12,500) per year (for lodging and daily subsistence)*

- MSc/ MA: up to 1 year
- MPP: up to 2 years 

*BXAI provides up to US$25,000 per year, subject to a maximum commitment of US$50,000 per student. The additional support is covered by HKUST.

 

Eligibility and Selection Criteria

  • New students from East, Southeast, and South Asia, except Hong Kong, with priority given to Japanese
  • High proficiency in English
  • Applicants should possess:
    • Strong personal integrity
    • Propensity for international and intercultural understanding
    • Compassion and willingness to serve

 

Requirements

  • Commitment to attending a 3-week BXAI Summer Program
  • Participation in programs/activities offered by the university for the AFLSP, such as:
    • Leadership training in the form of talks and activities;
    • Off-campus events including visits and seminars aiming to enrich students’ historical, cultural and economic knowledge of Asian countries

   

 

Application Deadline

Details to be provided.  Please stay tuned. 

 

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